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LNP Develops Colorable Compound for Molded Electronic Devices
More materials’ companies are coming onboard with materials developed for the Laser Direct Structuring process. The result will be continued penetration of the technology into three-dimensional...
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3D Electronics Debut in Sensor Application; Lighting Is Next
Applications for the Laser Direct Structuring Process (LDS) are growing as major resin producers put muscle into the technology. In a new example, 2E mechatronic GmbH & Co. KG of Germany has...
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LPKF Fights Patent Infringement On LDS Process
On July 8, the Mannheim Regional Court in Germany ordered Motorola Deutschland and Motorola Mobility USA to refrain from selling cell phones in Germany that infringe on LPKF’s Laser Direct Structuring...
View ArticleInvention Targets Mechanical Weakness of Molded-In Antennas
Mitsubishi Engineering-Plastics Corp., Tokyo, says it has developed a superior compound for making three-dimensional antennas in cellphones. The glass-reinforced alloy of polycarbonate and ABS contains...
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